d a t a sh eet product data sheet supersedes data of 1997 apr 08 1999 apr 26 discrete semiconductors bsp31; bsp32; bsp33 pnp medium power transistors db ook, halfpage m3d087
1999 apr 26 2 nxp semiconductors product data sheet pnp medium power transist ors bsp31; bsp32; bsp33 features ? high current (max. 1 a) ? low voltage (max. 80 v). applications ? telephony and general industrial applications. description pnp medium power transistor in a sot223 plastic package. npn complements: bsp41 and bsp43. pinning pin description 1 base 2, 4 collector 3 emitter fig.1 simplified outline (sot223) and symbol. handbook, halfpage 4 123 mam288 top view 3 2, 4 1 limiting values in accordance with the absolute maximum rating system (iec 134). note 1. device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm 2 . for other mounting conditions, see ?thermal considerations for sot223 in the general part of associated handbook?. symbol parameter conditions min. max. unit v cbo collector-base voltage open emitter bsp31 ? ? 70 v bsp32; bsp33 ? ? 90 v v ceo collector-emitter voltage open base bsp31 ? ? 60 v bsp32; bsp33 ? ? 80 v v ebo emitter-base voltage open collector ? ? 5 v i c collector current (dc) ? ? 1 a i cm peak collector current ? ? 2 a i bm peak base current ? ? 200 ma p tot total power dissipation t amb = 25 c; note 1 ? 1.3 w t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c t amb operating ambient temperature ? 65 +150 c
1999 apr 26 3 nxp semico nductors product data sheet pnp medium power transisto rs bsp31; bsp32; bsp33 thermal characteristics note 1. device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm 2 . for other mounting conditions, see ?thermal considerations for sot223 in the general part of associated handbook?. characteristics t amb = 25 c unless otherwise specified. note 1. pulse test: t p 300 s; 0.01. symbol parameter conditions value unit r th j-a thermal resistance from junction to ambient note 1 93 k/w r th j-s thermal resistance from junction to soldering point 12 k/w symbol parameter conditions min. max. unit i cbo collector cut-off current i e = 0; v cb = ? 60 v ? ? 100 na i e = 0; v cb = ? 60 v; t j = 150 c ? ? 50 a i ebo emitter cut-off current i c = 0; v eb = ? 5 v ? ? 100 na h fe dc current gain bsp32 i c = ? 100 a; v ce = ? 5 v; note 1 10 ? i c = ? 100 ma; v ce = ? 5 v; note 1 40 120 i c = ? 500 ma; v ce = ? 5 v; note 1 30 ? dc current gain bsp31; bsp33 i c = ? 100 a; v ce = ? 5 v; note 1 30 ? i c = ? 100 ma; v ce = ? 5 v; note 1 100 300 i c = ? 500 ma; v ce = ? 5 v; note 1 50 ? v cesat collector-emitter sa turation voltage i c = ? 150 ma; i b = ? 15 ma; note 1 ? ? 250 mv i c = ? 500 ma; i b = ? 50 ma; note 1 ? ? 500 mv v besat base-emitter saturation voltage ic = ? 150 ma; ib = ? 15 ma; note 1 ? ? 1 v i c = ? 500 ma; i b = ? 50 ma; note 1 ? ? 1.2 v c c collector capacitance i e = i e = 0; v cb = ? 10 v; f = 1 mhz ? 20 pf c e emitter capacitance i c = i c = 0; v eb = ? 0.5 v; f = 1 mhz ? 120 pf f t transition frequency i c = ? 50 ma; v ce = ? 10 v; f = 100 mhz 100 ? mhz switching times (between 10% and 90% levels) t on turn-on time i con = ? 100 ma; i bon = ? 5 ma; i boff = 5 ma ? 500 ns t off turn-off time ? 650 ns
1999 apr 26 4 nxp semico nductors product data sheet pnp medium power transisto rs bsp31; bsp32; bsp33 package outline unit a 1 b p cd e e 1 h e l p qy w v references outline version european projection issue date iec jedec eiaj mm 0.10 0.01 1.8 1.5 0.80 0.60 b 1 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 2.3 e 4.6 7.3 6.7 1.1 0.7 0.95 0.85 0.1 0.1 0.2 dimensions (mm are the original dimensions) sot223 sc-73 97-02-28 99-09-13 w m b p d b 1 e 1 e a a 1 l p q detail x h e e v m a a b b c y 0 2 4 mm scale a x 13 2 4 plastic surface mounted package; collector pad for good heat transfer; 4 leads sot223
1999 apr 26 5 nxp semiconductors product data sheet pnp medium power transist ors bsp31; bsp32; bsp33 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content, except for package outline drawings which were updated to the latest version. printed in the netherlands 115002/00/03/pp6 date of release: 1999 apr 26 document order number: 9397 750 05772
|
